Apparatus and method for limiting noise and smoke emissions due to failure of electronic devices or assemblies

ABSTRACT

An apparatus and method are provided for limiting failure noise and smoke emissions produced as a result of electrical failure conditions and/or failed electronic devices or assemblies of electronic equipment, such as IT and telecommunications equipment. In one aspect, the apparatus includes a conformable pad, a gasket and a clip that are disposed along one or more surfaces or planes of one or more electronic devices or assemblies such that the apparatus helps to form a substantially air tight seal around the one or more devices or assemblies. The air tight seal the apparatus defines minimizes or eliminates failure noise and smoke emissions generated as a result of failure conditions or catastrophic failure of the one or more devices or assemblies. The apparatus thereby provides a non-electronic solution to limiting failure noise and smoke that is relatively inexpensive to manufacture and implement, and enables in-field servicing of its components and the devices or assemblies to which it is applied.

FIELD OF THE INVENTION

The invention provides an apparatus and method for limiting the magnitude of sound and the extent of observable smoke produced due to electrical failure of electronic equipment and, more particularly, for limiting noise of a failed electronic device or assembly and the amount of observable smoke produced as a result of such failure.

BACKGROUND OF THE INVENTION

Prior art methods and devices for providing alarms or alert signals to indicate the occurrence of electrical failure of electronic equipment include methods and devices that produce an audible alarm, such as a local alarm, in response to the detection of failure conditions or the failed state of one or more electronic devices or assemblies including semiconductors, transistors, capacitors, diodes, and other similar components. In particular, audible alarms are often used in monitoring methods and devices to alert operators of the electrical failure of devices or assemblies associated with power converters, uninterruptible power supplies and other power electronics used with IT and telecommunications equipment. Many of such alarms elicit relatively loud noises in response to detected failures.

In addition, failure noise produced by an electronic device or assembly as a result of catastrophic failure or the presence of failure conditions can be relatively loud. For instance, failure of a device such as an integrated gate bipolar transistor (IGBT) would elicit a particularly loud noise if the transistor operates from a high voltage bus having relatively high levels of stored electrical energy. Failure noise is often exceedingly loud and is typically not intentionally used as an audible alarm to alert operators of failed conditions. Loud failure noise, along with the consequent smoke emissions produced from failed devices and assemblies, can cause operators and other persons in, for instance, equipment rooms or data centers to become startled, as well as can prompt unnecessary evacuations of the premises in locations that enforce strict fire codes. In these cases, the magnitude of the failure noise and/or the observable smoke may not represent the extent of actual hazards or conditions the electrical failures pose.

Electronic detection schemes are used to help to detect failure conditions and to prevent catastrophic failure of devices and assemblies of electronic equipment that include electronic monitoring and sensing circuits. Such electronic circuits are configured to monitor and/or to measure electrical current, drive signals from drive/control circuits and/or voltages across corresponding devices and assemblies in order to identify conditions for failure and to prevent catastrophic failure of devices and assemblies, to thereby manage failure noise and smoke emissions. For instance, a detection scheme of monitoring electrical signals and/or monitoring power drive signals would detect failure conditions associated with a device or assembly and would cause, for instance, a power converter to shut down and discontinue electrical power to a device in response to the detected conditions. The power shut down prevents the catastrophic failure of the device and thereby prevents failure noise and smoke emissions. In another similar instance, a scheme of monitoring drive signals and voltages across corresponding devices or assemblies would determine whether the voltage to individual devices or assemblies corresponds to the signals driving the device or assembly. Such a scheme would shut down a power converter to avoid device or assembly failure and to thereby prevent failure noise and smoke emissions. Further, electrical means, such as fuses, may be incorporated in a series with devices and assemblies to help to minimize or prevent catastrophic damage to devices or assemblies and, as a consequence, to help to minimize or prevent failure noise and smoke emissions.

Other methods to achieve smokeless and soundless detection of electrical failure include the process of potting, which involves containing devices and assemblies within potting material. The potting material helps to create a barrier around the devices and assemblies to limit or prevent sound and smoke emissions produced as a result of failed devices and assemblies.

The known devices and methods mentioned above have various disadvantages. Devices and methods that produce audible alarms that sound locally in response to the detection of failure conditions or states may be unnecessarily loud or excessive and do not prevent smoke emissions.

With respect to monitoring and sensing schemes, due to the nature of the detection circuits involved, such schemes are susceptible to false tripping of detection circuits and introducing false detections, creating false indications of electrical failure, unnecessary power shut down and erroneous perceptions of hazardous conditions. Electronic monitoring and sensing schemes also do not eliminate failure noise under all types of failure conditions. In addition, such schemes can be ineffective if the underlying cause of an electrical failure is within the drive/control circuit of devices or assemblies. Furthermore, if such schemes require certain electronic components, such as current sensors, then detection schemes of this type can be relatively expensive to implement.

In addition, electronic detection schemes may not entirely prevent smoke emissions into an equipment room or data center produced as a result of failure conditions or the catastrophic failure of devices or assemblies. As mentioned, in locations enforcing strict fire codes, or having a heightened sensitivity toward any volume of observable smoke, such schemes do not accomplish smokeless failure detection and are ineffective as smoke barriers.

Further, procedures such as potting are relatively expensive and do not permit servicing of potted devices and assemblies. Also, design changes to electronic devices or assemblies, and in particular to such components as printed circuit boards, that are required to achieve soundless and smokeless electronic detection of failure conditions, may be significant and costly, as well as ineffective for all electrical conditions.

Thus, as an alternative to at least electronic monitoring and sensing schemes as a means for managing and/or preventing the production of noise and smoke as a result of electrical failure of devices and assemblies that overcomes the disadvantages of the prior art and achieves smokeless and noiseless detection of electrical failure is desirable.

SUMMARY OF THE INVENTION

In general, in an aspect, the invention provides an apparatus for providing a smoke barrier and a sound barrier to at least one electronic device. The apparatus includes a conformable pad defining a length and a width sufficient to substantially cover at least a first plane that the at least one electronic device defines, and a gasket defining a length and a width sufficient to substantially cover at least a second plane that the at least one electronic device defines wherein the at least second plane includes a perimeter plane. The apparatus further includes a clip constructed and arranged to attach to the at least one electronic device and configured to cover at least a portion of the conformable pad.

Implementations of the invention may include one or more of the following features. The clip defines a first and a second side wall, each side wall being constructed and arranged to removably attach the clip to the at least one electronic device. Each of the first and second side walls defines a tab configured and sized to attach the side wall to the at least one electronic device. The clip defines a depth sufficient to accommodate the conformable pad and to apply pressure to the conformable pad such that, in response to such pressure, the conformable pad mates with the at least one electronic device along the first plane.

The gasket defines one or more spacers with each spacer configured and sized such that a gap or space defined by the at least one electronic device receives at least a portion of the spacer. The spacer is further configured and sized such that the portion of the spacer at least partially blocks or fills the gap or space.

Implementations of the invention may also include one or more of the following features. The apparatus further includes a shim constructed and arranged to attach along a third plane that the at least one electronic device defines and is not covered by the conformable pad or the gasket. The third plane includes a bottom portion or plane that the at least one electronic device defines.

The conformable pad, the gasket, and the clip, when assembled to the at least one electronic device, collectively help to form a substantially air tight seal around the at least one electronic device. In addition, the conformable pad, the gasket, the clip, and the shim, when assembled to the at least one electronic device, collectively help to form a substantially air tight seal around the at least one electronic device.

The at least one electronic device includes at least one of: a semiconductor, a diode, a transistor, a capacitor, and other electronic device, and any combinations thereof.

In general, in another aspect, the invention provides a method for providing a smoke barrier and a sound barrier to one or more electronic devices. The method includes disposing at least one conformable pad along at least a first plane the one or more electronic devices define and disposing at least one gasket along at least one or more perimeter planes the one or more electronic devices define. The method further includes applying pressure to the conformable pad such that, in response to the application of pressure, the conformable pad mates with and molds to the one or more electronic devices along the first plane, attaching the clip to at least the conformable pad, and, if required, applying pressure to the clip such that, in response to the application of pressure, the conformable pad further mates with and molds to the one or more electronic devices along the first plane.

Implementations of the invention may include one or more of the following features. The method further includes disposing the at least one conformable pad along the first plane such that the conformable pad mates with one or more portions of one or more spacers the gasket defines. Each portion of a spacer extends from a second plane opposite to the first plane through a gap or space that is defined by a configuration or arrangement of the one or more electronic devices.

Various aspects of the invention may provide one or more of the following features and/or one or more of the following advantages. Soundless and smokeless detection of electrical failure conditions or of failed states of devices and assemblies, such as semiconductors, diodes, transistors, capacitors and other similar electronics, can be achieved, in part, by employing a non-electronic apparatus and method that help to limit smoke and sound emissions produced as a result of electrical failure. Without electronic parts, the apparatus of the invention minimizes or eliminates instances of false tripping and false detections that monitoring and sensing schemes are inherently susceptible to. The apparatus defines a single unit when assembled to contain and to thereby limit the failure noise and observable smoke produced from electrical failure conditions and/or failed devices and assemblies. The single unit is configured to help to form a substantially air tight seal around one or more devices or assemblies to create a barrier that limits sound and limits smoke emissions. The apparatus may be configured to apply to existing or to new devices and assemblies, and is further configured for easy assembly and disassembly to permit in-field servicing and/or replacement, as well as to permit in-field servicing and/or replacement of a device or assembly to which the apparatus is applied. False alarms and unnecessary evacuations of equipment rooms or data centers located in areas requiring adherence to strict fire codes, and/or in areas particularly sensitive to sound and/or smoke emissions are minimized or eliminated. The invention further provides an apparatus that is relatively inexpensive to manufacture and relatively easy to install or service as compared to designing and implementing electronic monitoring and sensing schemes for electrical failure detection.

These and other features or advantages of the invention, along with the invention itself, will be more fully understood after a review of the following figures, detailed description, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view of an apparatus according to one aspect of the invention and an electronic assembly to which the apparatus may be attached including a plurality of electronic devices and a heat sink;

FIG. 2 is an exploded perspective view of the apparatus of the invention and the electronic assembly shown in FIG. 1;

FIG. 3 is a perspective view of the apparatus of the invention and the electronic assembly shown in FIGS. 1 and 2 with the apparatus at least partially assembled and attached to the electronic assembly;

FIG. 4 is a block flow diagram of a method according to another aspect of the invention for providing one or more electronic devices or assemblies with a sound and a smoke barrier;

FIG. 5 is an perspective view of a foam pad integral with an outer clip of the apparatus of the invention shown in FIGS. 1-3; and

FIG. 6 is an exploded perspective view of an apparatus according to a further aspect of the invention and an electronic assembly to which the apparatus may be attached including a plurality of devices and a heat sink.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The invention provides an apparatus and method for limiting or reducing the magnitude of sound of an audible alarm elicited in response to the detection of an electrical failure of electronic equipment. In addition, the invention provides an apparatus and method for reducing or eliminating failure noise as a result of electrical failure of electronic devices and assemblies of electronic equipment. The apparatus and method of the invention further provide a smoke barrier for limiting or reducing the extent of observable smoke emissions that electronic devices and assemblies produce as a result of failure conditions or catastrophic failures. Each of the apparatus and the method according to the invention is non-electrical and non-electronic thereby minimizing or reducing opportunities for and instances of false tripping and false failures of electronic monitoring and sensing schemes employed for electrical failure detection. In addition, the apparatus according to the invention defines a single unit or assembly that is configured for both sound and smoke containment that helps to limit or reduce noise and smoke emissions under any failure condition. Further, the apparatus of the invention is constructed and arranged for easy assembly and disassembly to electronic devices and assemblies and thereby permits in-field servicing including repair and/or replacement of the components of the apparatus as well as of failed electronic devices and assemblies. The invention is not limited with respect to the applications in which the apparatus and the method may be employed, and envisions the apparatus and the method may be configured for use with any of a variety of electronic devices and assemblies that constitute operational parts or components of electronic equipment. Such electronic devices and assemblies may include semiconductors, diodes, transistors, capacitors and other similar electronic parts and components as either individual devices or integrated assemblies having multiple devices.

For purposes of disclosing a preferred aspect of the invention, the apparatus and method are described in detail below with respect to electronic devices and assemblies associated with power converters, uninterruptible power supplies and other power electronics used with IT, telecommunications and other electronic equipment. In addition, to describe the invention in detail, the terms “semiconductors” and “semiconductor assembly” refer to devices and assemblies incorporating semiconductor materials as well as other electronic devices including diodes, transistors, capacitors, other similar electronics and combinations of such components configured as integrated assemblies.

Referring to FIGS. 1 and 2, in an aspect, the invention provides an apparatus 10 configured as a single unit or assembly including an outer clip 12, a foam pad 14, a gasket 16, and, if required, a shim 18. Each of the outer clip 12, the foam pad 14, the gasket 16, and the shim 18 is configured for a particular application to one or more electronic devices or assemblies including, but not limited to, semiconductors, diodes, transistors, capacitors and other similar electronic components. The one or more devices and assemblies can be identical or a combination of two or more types.

FIGS. 1 and 2 show an illustrative application of the apparatus 10 according to the invention. The apparatus 10 is constructed and arranged to help to enclose or cover one or more semiconductor devices 20, e.g., one or more Ufast diodes or insulated gate bipolar transistors (IGBTs), mounted to, for instance, a heat sink 22. The apparatus is disposed along one or more surfaces or planes the combination of semiconductors 20 define. In this application, as shown in FIG. 2, the one or more semiconductor devices 20 are attached to a heat sink 22 and this combination of devices and heat sink is collectively referred to, for purposes of disclosing the invention, as the semiconductor assembly 24.

The foam pad 14 and the gasket 16 attach to one or more semiconductors 20 along certain surfaces or planes the semiconductors 20 define when the semiconductors 20 are assembled to help to cover such surfaces or planes and to help to block or fill any gaps or spaces the semiconductor combination and/or arrangement defines. The gasket 16 helps to secure a top, sides and bottom surface or plane of the one or more semiconductors 20. The foam pad 14 and the gasket 16 thereby help to enclose the semiconductors 20.

The clip 12 is attached over at least the foam pad 14 to the semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24, to help to secure the foam pad 14 and/or the gasket 16 to the semiconductors 20.

When assembled, the clip 12, the foam pad 14 and the gasket 16, along with the shim 18, if required, collectively help to enclose the one or more semiconductors 20 and thereby help to form a substantially air tight seal around the semiconductors 20, e.g., that permits little or no smoke to vent from an internal area defined at least in part by the apparatus 10 when enclosing the one or more semiconductors 20. The seal helps to provide a smoke barrier around the one or more semiconductors 20 to contain smoke produced as a result of failed semiconductors or failure conditions and to thereby prevent smoke from venting to an area external to the one or more semiconductors 20 and the apparatus 10.

In addition, the components of the apparatus 10 collectively help to enclose the one or more semiconductors 20 to provide a sound barrier around the semiconductors 20, e.g., that eliminates or limits the sound of failure noise produces as a result of electrical failure conditions and/or one or more failed semiconductors 20.

The apparatus 10 according to the invention is not limited to the construction and arrangement shown in FIGS. 1 and 2. The invention envisions the apparatus 10 and each of its components can define other configurations and arrangements to accommodate the number, type, configuration and arrangement of one or more semiconductors 20 and any associated components assembled with the one or more semiconductors 20 to help to collectively form a substantially air tight seal around the semiconductors 20 such that a smoke and sound barrier are achieved.

The outer clip 12 is constructed and arranged to mate with, e.g., to contact or to be disposed against, one or more surfaces or planes that the one or more semiconductors 20 define, and/or at least a portion of one or more surfaces or planes the semiconductor assembly 24 defines, such that the clip 12 helps to cover at least a portion of such surfaces or planes. The clip 12 thereby helps to enclose and thereby helps to form the substantially air tight seal around the semiconductors 20

The clip 12 is further configured and sized such that the clip 12 fits to and mates with a particular combination and arrangement of the one or more semiconductors 20 to securely and removably attach the clip 12 to the one or more semiconductors 20, and/or to the semiconductor assembly 24. In addition, the clip 12 may be further configured and sized such that a portion of each side 12B of the clip 12 mates with, e.g., contacts or is disposed against, and securely and removably attaches to the one or more semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24, along a side portion of the semiconductors 20 and/or assembly 24, as shown in FIG. 3. The clip 12 may be still further configured along each side 12B to define one or more tabs 12C integral with the side 12B. Each tab 12C may be configured and sized to help to securely and removably attach the clip 12 to the one or more semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24.

As shown in FIGS. 1 and 2, the outer clip 12 may be constructed and arranged as a three-sided housing to cover at least a first or front surface or plane 20A that the one or more semiconductors 20 define, as well as each side surface or plane 20B of the semiconductors 20 and/or the semiconductor assembly 24. In addition, the clip 12 may define one or more edges, apertures and/or other configurations along one or more surfaces of the clip 12 housing that are configured and sized to help to accommodate the particular configuration and/or arrangement of the one or more semiconductors devices 20 and/or any of the one or more fasteners, connectors or other means 23 used to mount the semiconductors 20 to the heat sink 22 or other substrate.

Referring to FIG. 3, and with further reference to FIGS. 1 and 2, in an illustrative application, the outer clip 24 includes an edge defining one or more configurations or U-shaped slots 12A configured to receive each fastener or connector, e.g., each screw/washer combination, used to assemble the semiconductors 20, and/or used to mount each semiconductor device 20 to the heat sink 22. Once the semiconductors 20 are mounted to the heat sink 22 assembly 24, each U-shaped slot 12A receives one of the fasteners or connectors 23 to help to permit the clip 12 to mount to the semiconductor assembly 24.

The clip 12 may be further configured and sized to help to accommodate any feature or component of the one or more semiconductors 20, such as the connectors 27 shown in FIGS. 1 and 2 that extend from each semiconductor 20. The clip 12 configuration helps to permit the connectors 27 to extend from the semiconductors 20 to an area external to the clip 12 and the apparatus 10 when the clip 12 is attached to the one or more semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24. The invention anticipates that the clip 12 may define any configuration and size that helps to permit the clip 12 to accommodate certain features or components of the electronic devices or assemblies 20 to which it is attached.

In addition, the clip 12 is also configured and sized to help to accommodate the foam pad 14 that mates with, e.g., contacts or is disposed against, one or more surfaces or planes that the one or more semiconductors 20 define. In particular, the clip 12 is configured and sized to receive and to enclose the foam pad 14 when the pad 14 is placed over and mated with the one or more surfaces or planes of the semiconductors 20. The clip 12 therefore is configured and sized in relation to the dimensions and the thickness of the foam pad 14 in addition to the particular configuration and/or arrangement of the one or more semiconductors 20.

As mentioned, the invention is not limited with respect to the construction and arrangement of the outer clip 12 and envisions the clip 12 may define any configuration and size that is required to mate with one or more surfaces or planes that the one or more semiconductors 20 define and to help to accommodate the foam pad 14.

With further reference to FIGS. 1-3, the foam pad 14 is configured and sized to be disposed on at least one surface or plane that the one or more semiconductors 20 define and to mate with, e.g., to contact or to be disposed against, such surface or plane. As best shown in FIG. 2, the foam pad 14 defines a length L₁ and a width W₁ such that when the pad 14 is disposed over and mates with at least one surface or plane, the pad 14 substantially covers the surface or plane, e.g., little or no portion of the surface or plane is exposed.

The foam pad 14 is constructed of a conformable material such that when the pad 14 is disposed along a surface or plane and pressure is applied to the foam pad 14, e.g., when the clip 12 is attached over the pad 14 and to the one or more semiconductors 20 and/or to the heat sink 22 of the assembly 24, the pad 14 conforms to the shapes and contours of each semiconductor 20 and helps to cover any spaces or gaps between adjacent semiconductors 20 along the surface or plane. The pad 14 essentially molds to the one or more semiconductors 20 in response to an application of pressure and thereby helps to form, with the clip 12, the gasket 16 and the shim 18, a substantially air tight seal and a sound barrier around the one or more semiconductors 20.

As shown in the illustrative application of FIGS. 1-3, the pad 14 defines a length L₁ and a width W₁ that does not enable the pad 14 to wrap around side surfaces or planes that the one or more semiconductors 20 may define, but rather limits the conformation of the pad 14 to the one or more semiconductors 20 along a first or front surface or plane 20A. When the clip 12 is attached to the pad 14 and the one or more semiconductors 20, and/or to the semiconductor assembly 24, the side portions 12B of the clip 12 mate with side surfaces or planes 20B, and/or with the heat sink 22, to help to securely and removably fasten the clip 12 to the semiconductors 20, and/or to the semiconductor assembly 24, and to further help to ensure the pad 14 remains intact and in position.

In addition, the pad 14 defines a certain thickness T₁ to help to form a substantially air tight seal and a sound barrier around the semiconductors 20. The thickness T₁ of the pad 14 also helps to accommodate the depth of the clip 12 and helps to fill or block off any space or gap between the surface or plane 20A to which the pad 14 is mated with and an interior surface of the clip 12 that is in contact with the pad 14 when the clip 12 is attached over the pad 14.

The invention is not limited with respect to the configuration and the size of the foam pad 14 and anticipates that the pad 14 may define any configuration and size having any length L₁, width W₁, and thickness T₁ to permit the pad 14 to cover and to conform or mold to the shapes and contours of a particular combination and/or arrangement of one or more semiconductors 20 to thereby help to form, along with the clip 12, the gasket 16 and the shim 18, a substantially air tight seal and a sound barrier.

Still referring to FIGS. 1-3, the gasket 16 is constructed and arranged as a single component and is configured and sized to be disposed along one or more surfaces or planes that the one or more semiconductors 20 define, e.g., that may not be covered by the foam pad 14. In the illustrative application shown in FIGS. 1 and 2, the gasket 16 is configured and sized to be disposed along one or more surfaces or planes each semiconductor 20 defines as outer perimeter surface or plane 20B and 20C, e.g., a top, side and/or bottom surfaces or planes. As shown in FIGS. 1 and 2, when attached to the one or more semiconductors 20, the configuration of the gasket 16 permits one or more surfaces or planes of the one or more semiconductors 20 to be disposed against or in contact with a surface of the heat sink 22. In this manner, any heat the semiconductors 20 produce during operation may be conducted from the semiconductors 20 to the heat sink 22. In this case, the gasket 16 is configured as a “backless” gasket.

As best shown in FIGS. 1 and 2, the gasket 16 defines a length L₂ and a width W₂ such that when the gasket 16 is disposed over and mates with, e.g., contacts or is disposed against, one or more of the perimeter surfaces or planes 20B and 20C, the gasket 16 substantially covers the one or more perimeter surfaces or planes 20B and 20C, e.g., little or no portion of one or more of the perimeter surfaces or planes 20B and 20C is exposed.

In addition, the gasket 16 defines, along its surface that covers and mates with the perimeter surfaces or planes 20B and 20C, one or more configurations 16A, e.g., vertical walls or spacers. Each configuration 16A is configured and sized to help to fill any gap or space 40 defined between adjacent semiconductors 20. As shown in FIGS. 1 and 2, each vertical wall or spacer 16A is configured and sized such that any gap or space 40 defined between adjacent semiconductors 20 receives the vertical wall or spacer 16A, and the vertical wall or spacer 16A thereby helps to fill the gap or space 40. Each vertical wall or spacer 16A is further configured and sized such that when the gasket 16 is attached to the semiconductors 20 and the foam pad 14 is mated with the first or front surfaces or planes 20A of the semiconductors 20, each vertical wall or spacer 16A extends through a gap or space 40 and a portion of each wall or spacer 16A mates with, e.g., is disposed against, the foam pad 14 along the points of contact with the foam pad 14. The vertical walls or spacers 16A, along with the clip 12, the foam pad 14 and the shim 18, help to form a substantially air tight seal and a sound barrier around the one or more semiconductors 20.

During assembly of the apparatus 10, the gasket 16 may be connected initially to the one or more semiconductors 20 and then the foam pad 14 and the clip 12 may be applied. When the gasket 16 is installed, the vertical walls or spacers 16A help to provide a surface against which the foam pad 14 may press when pressure is applied to the foam pad 14, e.g., via the clip 12 when the clip 14 is being attached to the pad 14 and the semiconductors 20. The application of pressure enables the foam pad 14 to conform and mold not only to the shapes and contours of the semiconductors 20, but also helps to mate with those portions of the vertical walls or spacers 16A extending through the gaps or spaces 40 between adjacent semiconductors 20.

In addition, the gasket 18 may define certain configurations along one or more of its surfaces to accommodate certain features or components of the semiconductors 20 and/or the semiconductor assembly 24. As shown in FIGS. 1 and 2, the gasket 16 defines internal configurations to help to accommodate a thermal switch 21 incorporated with the combination of the semiconductors 20 shown.

The invention envisions other configurations and arrangements of the gasket 16 with respect to a particular combination and/or arrangement of the one or more semiconductors 20 in order the gasket 16 may accommodate a certain feature or component of or associated with the semiconductors 20, as well as to help to form a substantially air tight seal and sound barrier around the semiconductors 20.

As shown in FIGS. 1-3, the apparatus 10 further includes the shim 18 which is constructed and arranged to be disposed along a bottom portion that the one or more semiconductors 20 and/or the semiconductor assembly 24 defines. As best shown in FIG. 3, when the clip 12, the foam pad 14 and the gasket 16 are attached to the one or more semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24, the shim 18 is constructed and arranged to be disposed along the bottom portion of the semiconductors 20 and/or the semiconductor assembly 24. The shim 18 is configured and sized to help to fill any gap or space along the bottom portion of the semiconductors 20 or the semiconductor assembly 24 such that the shim 18 helps to form or complete along with the clip 12, the foam pad 14 and the gasket 16 a substantially air tight seal and a sound barrier around the one or more semiconductors 20. The shim 18 may be held in place via fasteners or connectors 23, e.g., mounting screws, that help to mount the one or more semiconductors 20 and/or the semiconductor assembly 24 to a substrate, such as a printed circuit board (PCB); however, the shim 18 may be attached to the one or more semiconductors 20 and/or the semiconductor assembly 24 by other suitable means.

The shim 18 may be further configured to accommodate any feature or component of the one or more semiconductors 20 and/or the semiconductor assembly 24. In the illustrative application shown in FIGS. 1-3, the shim 18 may define along one or more edges, and/or any of its surfaces, certain configurations and/or apertures 18A to help to accommodate, for instance, the one or more connectors 27 extending from the one or more semiconductors 20 such that the connectors 27 may be associated with a certain PCB or other substrate to which the semiconductors 20 are mounted. As shown in FIG. 3, one edge of the shim 18 defines a number of configurations 18A. Each configuration 18A is shaped and sized to permit the connectors 27 of the semiconductors 20 to extend to an area external to the apparatus 10 when the apparatus 10 is assembled such that the connectors 27 may be joined with the interconnections along a surface of a PCB or other substrate.

The shim 18 therefore is configured and sized to help to complete the substantially air tight seal and the sound barrier formed with the clip 12, the foam pad 14 and the gasket 16, and to help to maintain the seal and the sound barrier when the semiconductors, 20 or the semiconductor assembly 24, is mounted to a surface of a PCB or other substrate.

The invention is not limited with respect to the construction and arrangement of the shim 18 and anticipates other configurations and sizes of the shim 18 that may be required to help to complete the air tight seal and the sound barrier along a bottom portion of the one or more semiconductors 20, or the semiconductor assembly 24, and to help to ensure the air tight seal and the sound barrier are maintained when the semiconductors 20 are assembled and/or mounted to a PCB or other substrate.

As the illustrative application of FIGS. 1-3 shows, when the clip 12, the pad 14, the gasket 16 and the shim, if required, are assembled with and connected to the one or more semiconductors 20, a portion of the heat sink 22, e.g., a plane or surface to which the one or more semiconductors 20 are attached, helps to form the substantially air tight seal around the semiconductors 20. In other configurations and/or arrangements of the one or more semiconductors 20, one or more portions, e.g., one or more surfaces or planes, of one or more components associated with the one or more semiconductors, e.g., the heat sink 22, may help to form along with the apparatus 10 the substantially air tight seal around the semiconductors 20. The invention is not limited in this respect and anticipates that certain portions of other components that are associated with the one or more semiconductors 24 or the semiconductor assembly 24 may help to form along with the apparatus 10 the substantially air tight seal and thereby a sound and smoke barrier around the semiconductors 20 and/or the associated components.

Continuing to refer to FIGS. 1-3, the various components of the assembly 10 may be constructed of one or more preferred materials suitable for a particular configuration, function and/or performance of the component. The outer clip 12 is constructed of one or more materials suitable for providing the clip 12 with high impact strength, shatter resistance and flexibility as well as for maintaining the clip 12 as a lightweight component. Such materials include, but are not limited to, one or more plastics, e.g., Lexan® polycarbonate, and one or more metals, e.g., insulated or vinyl-coated metals including aluminum.

The foam pad 14 is constructed of one or more materials suitable for providing a thermally conductive interface and for imparting a low modulus, highly conformable nature to the pad 14 such that the pad 14 deflects in response to a minimal amount of applied pressure. Such materials include, but are not limited to, rubber and silicone polymers such as those used to form Gap Pro VO®, Gap Pad VO Soft® and Gap Pad VO Ultra Soft® interface pads available from The Bergquist Company of Chanhassen, Minn.

The gasket 16 is constructed of one or more materials suitable for imparting flexibility to the gasket 16 including, but not limited to, silicone, e.g., having a UL flammability rating of UL 94V-O and a durometer range (Shore A) of from about 30 to about 80 and preferably about 50, synthetic rubber, e.g., solid neoprene, and plastic, e.g. solid urethane.

The shim 18 is constructed of one or more materials suitable for providing electrical insulation, anti-fire and high mechanical properties to the shim 18 as well as high flexural, impact and bond strength. Such materials include, but are not limited to, insulated composites and glass-reinforced composites, e.g., G-10 or FR-4 composite materials such as those available from GE of Woburn, Mass.

With further reference to FIGS. 1-3, placement and assembly of the apparatus 10 is relatively simple, can be performed quickly and facilitates disassembly for repair and/or replacement of the components of the apparatus 10 and/or the electronic devices or assemblies the apparatus 10 encloses. As shown in FIGS. 1-3, the one or more semiconductors 20 are connected to the heat sink 22, via one or more fasteners or connectors 23, e.g., one or more screw/washer combinations, to assembly the semiconductor assembly 24. The gasket 16 is disposed around the one or more semiconductors 20 along one or more perimeter surfaces or planes 20B and 20C. As shown in FIG. 1-3, an additional silicon pad 26 may be provided along the surface of the heat sink 22 to which the semiconductors 20 are attached.

Each vertical wall or spacer 16A of the gasket 16 inserts into a gap or space 40 defined between adjacent semiconductors 20 such that at least a portion of each vertical wall or spacer 16A extends through the gap or space 40 and projects slightly above the first or front surface or plane 20A of the semiconductors 20. The foam pad 14 is placed over the first or front surface or plane 20A of the semiconductors 20, and thereafter the clip 12 is attached to the one or more semiconductors 20, and/or to the heat sink 22 of the semiconductor assembly 24, to cover the foam pad 14 and the semiconductors 20. Pressure is applied to the clip 12 such that the interior surface of the clip 12 presses against the foam pad 14. In response to the application of pressure, the foam pad 14 mates with and molds to the shapes and contours of the semiconductors 20 along the first or front surfaces or plane 20A and also presses against and mates with those portions of the vertical walls or spacers 16A of the gasket 16 projecting slightly above the first or front surfaces or plane 20A. The installed gasket 16 and the foam pad 14 molded to the semiconductors 20 mate along the portions of the vertical walls or spacers 16A to help to form a substantially air tight seal and a sound barrier around the semiconductors 20. In addition, the installed clip 12, by surrounding the foam pad 14 and the semiconductors 20, helps to ensure that the pad 14 and the gasket 16 remain in position and also helps to form the seal and the sound barrier. The semiconductor assembly 24 with the apparatus 10 connected thereto may be then mounted to a PCB or other substrate. The shim 18 is disposed along the bottom portion of the semiconductor assembly 24, or the one or more semiconductors 20, and is mounted, along with the semiconductor assembly 24 or the semiconductors 20, to the surface of a PCB or substrate via one or more mounting screws. The shim 18 helps to completely enclose the semiconductors 20 within the apparatus 10 and to thereby help to complete the substantially air tight seal and the sound barrier around the semiconductors 20.

Referring to FIG. 4, and with further reference to FIGS. 1-3, in operation, another aspect the invention provides a process 100 for providing a sound barrier to limit the sound of failure noise and for providing a substantially air tight seal to limit smokes emissions produced as a result of electrical failure conditions and/or failed devices or assemblies. The process 100 includes the stages shown and is exemplary. However, the process 100 can be altered, e.g., by having stages added, removed or rearranged.

At stage 110, the one or more electronic devices 20, e.g., one or more semiconductors, are partially or fully assembled, e.g., mounted to the heat sink 22, prior to mounting the devices 20 to a PCB or other substrate. The conformable pad 14 is disposed along at least a first surface or plane 20A that the one or more electronic devices 20 define, and a gasket 16 is disposed along one or more perimeter surfaces or planes, e.g., top, sides and/or bottom, that the one or more devices 20 define.

At stage 120, pressure is applied to the conformable pad 14 such that the pad 14 mates with the first surface or plane 20A and molds to the shapes and contours of the devices 20 along the first surface or plane 20A, as well as helps to fill or block any gaps or spaces defined between adjacent devices 20, and/or defined by the combination and/or arrangement of the devices 20.

At stage 130, the clip 12 is disposed over the pad 14 and securely and removably attached to the one or more devices 20 and/or to the heat sink 22.

At stage 140, pressure is further applied against the clip 12 such that the pad 14 and the gasket 16 mate along one or more portions of the vertical walls or spaces 16A of the gasket 16 that extend through and slightly project from the gaps or spaces 40 defined between adjacent devices 20 and/or defined by the combination and/or arrangement of the devices 20.

At stage 150, the shim 18 is disposed along a bottom portion of the one or more semiconductors 20, or a surface or plane the one or more devices 20 define that remains exposed, to completely enclose the devices 20 and to thereby help to form a substantially air tight seal and a sound barrier around the devices 20.

Other aspects of the invention are within the scope and spirit of the appended claims. For instance, during assembly of the apparatus 10, the foam pad 14 may be applied directly to the first or front surface or plane 20A that the one or more semiconductors 20 define such that the pad 14 mates with the surface or plane 20A and molds to the shapes and contours of the semiconductors 20 to thereby help to fill or block gaps or spaces 40 between adjacent semiconductors 20 and between an interior surface of the clip 12 and the semiconductors 20. In this case, the pad 14 may be constructed of silicone and applied in an uncured or a semi-cured state to the semiconductors 20. Prior to cure of the silicon pad 14, the clip 12 may be attached to the semiconductors 20 and the pad 14 such that upon cure of the pad 14, the pad 14 adheres or bonds to the interior surface of the clip 12 to help to form, in conjunction with the gasket 16 and the shim 18, a substantially air tight seal and a sound barrier around the semiconductors 20.

Referring to FIG. 6, in a further aspect of the invention, the foam pad 14 may be integral with the clip 12 wherein the pad 14 is adhered or bonded to an interior surface of the clip 14 such that the clip 12 and the pad 14 form a single component. During assembly of the apparatus 10, the clip 12 is attached to the one or more semiconductors 20 and the integral pad 14 mates with and molds to the semiconductors 20 in response to an application of pressure to the cup 12, such that the integral pad 14 conforms to the shapes and contours of the semiconductors 20 and helps to fill any gaps or spaces 40 between adjacent semiconductors 20.

Referring to FIG. 6, as mentioned, the apparatus 10 according to the invention is applicable to other configurations and arrangements of the one or more semiconductors 20 and/or other electronic devices or assemblies. As shown in FIG. 6, one or more semiconductors 30 define a different configuration and arrangement when mounted to a heat sink 32 than shown in FIGS. 1-3. The configuration and arrangement include a semiconductor 30 mounted along each end of the heat sink 32. A clip 33 and a foam pad 34 are constructed and arranged to accommodate the number, configuration and arrangement of the one or more semiconductors 30 in order to help to enclose the semiconductors 30. The clip 33 and the foam pad 34 thereby help to provide, along with a shim (not shown) if needed, a substantially air tight seal and a sound barrier around the one or more semiconductors 30 when the clip 33 and the pad 34 are attached to the one or more semiconductors 30, and/or to the heat sink 32. The semiconductors 30 and the heat sink 32 are configured to mount to a PCB or other substrate. In particular, as shown in FIG. 6, the combination of the one or more semiconductors 30 and the heat sink 32 does not require the application of the gasket 16, as shown in FIGS. 1-3, to help to form the seal and the sound barrier. Rather, a surface to which the one or more semiconductors 30 are mounted provides a surface or plane that helps to enclose and thereby helps to form, together with the clip 33, the pad 34 and the shim (if required), the substantially air tight seal and the sound barrier around the one or more semiconductors 30.

Having thus described at least one illustrative aspect of the invention, various alterations, modifications and improvements will readily occur to those skilled in the art. Such alterations, modifications and improvements are intended to be within the scope and spirit of the invention. Accordingly, the foregoing description is by way of example only and is not intended as limiting. The invention's limit is defined only in the following claims and the equivalents thereto. 

1. An apparatus for providing a smoke barrier and a sound barrier to at least one electronic device, the apparatus comprising: a conformable pad defining a length and a width sufficient to substantially cover at least a first plane that the at least one electronic device defines; a gasket defining a length and a width sufficient to substantially cover at least a second plane that the at least one electronic device defines wherein the at least second plane includes a perimeter plane; a clip constructed and arranged to attach to the at least one electronic device and configured to cover at least a portion of the conformable pad; and a shim constructed and arranged to attach along a third plane that the at least one electronic device defines and is not covered by the conformable pad or the gasket.
 2. The apparatus of claim 1 wherein the clip defines a first and a second side wall, each side wall being constructed and arranged to removably attach the clip to the at least one electronic device.
 3. The apparatus of claim 2 wherein each of the first and second side walls defines a tab configured and sized to attach the side wall to the at least one electronic device.
 4. The apparatus of claim 1 wherein the clip defines a depth sufficient to accommodate the conformable pad and to apply pressure to the conformable pad such that, in response to such pressure, the conformable pad mates with the at least one electronic device along the first plane.
 5. The apparatus of claim 1 wherein the gasket further defines one or more spacers, each spacer being configured and sized such that a gap or space defined by the at least one electronic device receives at least a portion of the spacer, the spacer being further configured and sized such that the portion of the spacer at least partially blocks or fills the gap or space.
 6. The apparatus of claim 1 wherein the third plane includes a bottom portion or plane that the at least one electronic device defines.
 7. The apparatus of claim 6 wherein the conformable pad, the gasket, the clip and the shim, when assembled to the at least one electronic device, collectively help to form a substantially air tight seal around the at least one electronic device.
 8. The apparatus of claim 1 wherein the at least one electronic device includes at least one of: a semiconductor, a diode, a transistor, a capacitor, and other electronic device, and any combinations thereof.
 9. The apparatus of claim 1 wherein the conformable pad, the gasket and the clip, when assembled to the at least one electronic device, collectively help to form a substantially air tight seal around the at least one electronic device.
 10. The apparatus of claim 1, further comprising a heat sink, wherein the gasket is disposed between the conformable pad and the heat sink.
 11. An apparatus for providing a smoke barrier and a sound barrier to a plurality of electronic devices, the apparatus comprising: a conformable pad defining a length and a width sufficient to substantially cover a first plane that the plurality of electronic devices defines; a gasket defining a length and a width sufficient to substantially cover at least a second plane that the plurality of electronic devices defines wherein the at least second plane includes at least one perimeter plane; a clip constructed and arranged to attach to the plurality of electronic devices and configured to cover at least a portion of the conformable pad; and a shim constructed and arranged to attach along a third plane that the plurality of electronic devices defines and is not covered by the conformable pad or the gasket.
 12. The apparatus of claim 11 wherein the clip defines a first and a second side wall each side wall being constructed and arranged to removably attach the clip to the plurality of electronic devices.
 13. The apparatus of claim 12 wherein each of the first and second side walls defines a tab configured and sized to attach the side wall to the plurality of electronic devices.
 14. The apparatus of claim 12 wherein the gasket further defines one or more spacers, each spacer being configured and sized such that a gap or space defined between adjacent electronic devices of the plurality of electronic devices receives at least a portion of the spacer, the spacer being further configured and sized such that the portion of the spacer at least partially blocks or fills the gap or space.
 15. The apparatus of claim 14 wherein the conformable pad and the gasket are further configured and sized such that upon an application of pressure to the clip, in response to such pressure, the conformable pad presses against and mates with a portion of each spacer extending through the gap or space to the first plane.
 16. The apparatus of claim 15 wherein the conformable pad, the gasket, the clip and the shim, when assembled to the plurality of electronic devices, collectively help to form a substantially air tight seal around the plurality of electronic devices.
 17. The apparatus of claim 11 wherein the clip defines a depth sufficient to accommodate the conformable pad and to apply pressure to the conformable pad such that, in response to such pressure, the conformable pad mates with the plurality of electronic devices along the first plane.
 18. The apparatus of claim 11 wherein the third plane includes a bottom portion or plane the plurality of electronic devices defines.
 19. The apparatus of claim 11 wherein the conformable pad, the gasket and the clip, when assembled to the plurality of electronic devices, collectively help to form a substantially air tight seal around the plurality of electronic devices.
 20. The apparatus of claim 11 wherein the plurality of electronic devices includes one or more semiconductors, diodes, transistors, capacitors and other electronic devices, and any combinations thereof. 